Change kit

Applicable for Seiko Epson and Hontech series test handler.

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Loadboard

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Lay Out

Customized design and manufacturing. With/Without chamber layout kit, applicable for Seiko Epson and Hontech series test handler.

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Socket

Customized design, various package such as BGA, QFN, QFP, POP etc., for different test stages such as Final Test, O/S, SLT, Brun-In on Bluetooth, CMOS, Memory and RF Testing.

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LID

*Standard type Socket Lids
*Customized sockets for most packages and applications

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Vacuum pad

Customized design according to package size with ESD coating protection, anti-adhesion.

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Clean Pad

Customized design for various IC package, used for pogo pin cleanness to extend life time of pogo pin.

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Pogo Pin

Standard and customized design. Various material type such as Pd alloy, Beryllium Copper, SK4 etc. Diameter down to 0.11 mm.

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TIM(Thermal Interface Material)

Interface material between silicon and heat spreader/sink
Filling materials with high heat dissipation performance
Specializing in manufacturing process innovation, improving price competitiveness and user cost-effectiveness

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Customized Design

Product customized design consultancy, institutional improvement, customized jig design, customized testing equipment/tool/Jig design and manufacturing.

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