From the beginning of design and drawing, we have been in close communication and discussion with customers continuously from a professional perspective to prevent problems during production and after use in advance.
TESA Micro-Hite 350/600
TESA 電子式二次元高度規
精度誤差(全程) : ±(2+1.5Lmm)μm (Lunit=m)
垂直度 : 5μm / 7μm
量測範圍 : 415mm/ 615mm
ARCS-SVP Manual Image Measurement System SVP_2010
影像量測系統 : 高解析彩色攝影機
放大倍率 : 0.65X~4.5X(17X~112.5X)定倍式變焦鏡頭
光源 : 可調式冷光源 (表面光源+輪廓光源) 解析度0.001mm
X.Y軸線性精度 : ± (3+L/150)μm
KEYENCE High-Precision Image Size Measuring Instrument
透過自動調整焦距及自動辨識量測位置,每次皆可獲得相同量測結果,可同時量測及判定高達100個目標物,可快速精準的檢測產品視野
大視野量測模式 : 300 × 200 mm (4 角R 50)
高精度量測模式 : 225 × 125 mm
最小顯示單元 : 0.1 µm
Pogo Pin Socket Test Platform
Pogo Pin Force Measurement
Pogo Pin Distance Measurement
Pogo Pin Resistance Measurement
Digital Microscope
High-definition imaging makes it possible to observe subtle contours and uneven surfaces or stains that were previously impossible to view.。
Depth of field is more than 20 times higher compared with optical microscopes,.
Various measurements such as roughness measurement, cleanliness measurement, and crystal grain measurement.