Lay Out
Customized design and manufacturing. With/Without chamber layout kit, applicable for Seiko Epson and Hontech series test handler.
Socket
Customized design, various package such as BGA, QFN, QFP, POP etc., for different test stages such as Final Test, O/S, SLT, Brun-In on Bluetooth, CMOS, Memory and RF Testing.
Rubber Socket
測試插座是一種用於測試半導體晶片封裝後性能的設備。
作為出貨前篩選合格和不合格封裝產品的測試互連硬件，它臨時容納封裝好的晶片（被測器件，DUT），並建立機械接觸，作為DUT與測試設備之間電信號傳輸的媒介。
Vacuum pad
Customized design according to package size with ESD coating protection, anti-adhesion.
Clean Pad
Customized design for various IC package, used for pogo pin cleanness to extend life time of pogo pin.
Pogo Pin
Standard and customized design. Various material type such as Pd alloy, Beryllium Copper, SK4 etc. Diameter down to 0.11 mm.
TIM(Thermal Interface Material)
Interface material between silicon and heat spreader/sink
Filling materials with high heat dissipation performance
Specializing in manufacturing process innovation, improving price competitiveness and user cost-effectiveness
Customized Design
Product customized design consultancy, institutional improvement, customized jig design, customized testing equipment/tool/Jig design and manufacturing.
